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Objectives
The objective of this course is for the participants to:
- discover that electronics and electronic concepts are fundamentally quite simple, and governed only by a few key principles. These are made clear through the use of easy to understand analogies, such as electric current as compared to water current flowing through a tube.
- learn that electrical specs and characteristics, including those found on data-sheets, can be transformed from daunting rows and columns of numbers to meaningful performance characteristics - only a few key items of which are actually critical for any given device!
- become familiarized with the various families of semiconductors in existence today - what they do, who makes them, what is important about each of them.
- investigate why silicon is an ideal medium for building integrated circuits.
- explore how transistors, diodes and passive 'devices' are built upon a silicon wafer.
- understand what steps are taken to design, simulate and fabricate a new IC device, and why it often takes so long.
- review what job functions in a typical semiconductor factory are associated with the production of integrated circuits, and what the expertise each of these provides.
- make the distinction of "Marketplace", as it relates to semiconductor products.
- engage in a hands-on lab which allows them to personally measure and experience the effects of logic gates, resistors, and electronic concepts.
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PART
I
Welcome and
Introduction
Demystifying
Technical Conversations
Foundation of Electronics
Definition
The Electron
EMF
Electrical Current
Resistance/Conductivity
Circuit Fundamentals
Basic Elements
Passive
and Active
Elements Integrated
CircuitProcess Types
Silicon Run
I
VideoVideo
Discussion Including:
Ingots,
Masks, Wafers
Yield
Development Costs
Review, Q &
A
PART
II
Electricity
and Atomic Structure
The Atom
Electrons in Orbit
The Periodic Table
Dopant Characteristics
P/N Conduction
The Diode
IC Design &
Wafer Manufacturing
The Design
Process
Wafer Manufacturing
Silicon Run
II Video
Video Discussion
Including:
Time to
Market
Yield
Learning Curves
Die Shrinks
Shrink Limitations
Packaging
Industry
Trends
Package Construction
Review, Q &
A |
PART
III
Primary Characteristics
Instant
Time
Frequency
Propagation Delay
Access Time
Vcc, Icc, Isb
Data Sheet Review
Introduction
to Systems
What is
a System?
Digital Electronics
Semiconductor Types
Digital
Logic
Processors
Parallel and Serial Communications
Review, Q &
A
PART
IV
Semiconductor
Types, continued
Memory
Chips
USICs
ASICs
Custom ICs
Lab
Part 1:
Resistor Ratings
Part 2: Gates and Logic Functions
Markets and Applications
Market Segments
Applications
Open
Conversation
Job Functions
Engineering
Manufacturing
Quality and Reliability
Marketing
Sales
System Design Process
Concepts
and Organization
Functional Blocks
Building Blocks
Design Process
Review, Q &
A |
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